Product Details
The Hoffman T1F130LP, T1Flo™ Vented Enclosure is designed to provide effective heat removal with its thermostatically controlled forced-air ventilation system, featuring a fan that moves 130 CFM. Its dimensions are 34.00x24.00x12.75 inches and it is constructed of 14 gauge steel in a gray finish. This enclosure is ideal for housing control systems in HVAC or industrial environments, accommodating a combination of heat-sensitive electronics and high heat-producing components such as variable frequency drives (VFDs), inverters, programmable logic controllers (PLCs), and non-hardened processors. The enclosure is compliant with stringent industry standards, ensuring reliable performance in demanding applications.
